| Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions | |
| Mu, G. Q.; Qu, W. Q.; Wu, Y. C.; Zhuang, H. S. | |
| 2019 | |
| 会议名称 | 2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018) |
| 会议日期 | 2019-01-01 |
| 关键词 | Binary alloys Hardness Mechanical properties Microstructure Soldering Ternary alloys Thermal aging Tin alloys Aging conditions Aging temperatures Fracture feature Interfacial compounds Interfacial microstructure evolution Sn-based solders Solder interfaces Thermal aging tests Gold alloys |
| 卷号 | 504 |
| 收录类别 | EI ; CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000471242000008 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5919373 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Mu, G. Q.,Qu, W. Q.,Wu, Y. C.,et al. Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions[C]. 见:2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018). 2019-01-01. |
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