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The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 4, 页码: 90-96
作者:  Sui, Ran;  Lin, Qiaoli
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14
Wetting behavior of Fe/Sn system under ultrasonic 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 2, 页码: 12-17
作者:  Yu, Weiyuan;  Wu, Baolei;  Sun, Xuemin;  Lei, Zhen;  Sun, Jungang
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Wetting behavior of Fe/Sn system under ultrasonic 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 2, 页码: 12-17
作者:  Yu, Weiyuan;  Wu, Baolei;  Sun, Xuemin;  Lei, Zhen;  Sun, Jungang
收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
收藏  |  浏览/下载：114/0  |  提交时间：2020/12/16
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S.
收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30
Formation mechanism of a cathodic serrated interface and voids under high current density 期刊论文
MATERIALS LETTERS, 2018, 卷号: 211, 页码: 191-194
作者:  Zhang, Z. H.[1,2];  Cao, H. J.[3];  Chen, H. T.[4]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17

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