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浏览/检索结果: 共22条，第1-10条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Grain orientation  Electromigration  Intermetallic compounds  Diffusion   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：0/0  |  提交时间：2020/06/16 Intermetallic compounds  Grooves  Ultrasonic vibration  Dissolution  IMC   Interfacial reaction mechanism of TiBw/Ti6Al4V composites and Inconel 718 alloys by GTAW heat transmission 期刊论文 SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2019, 页码: 9 作者:  Gao YaNan;  Huang LuJun;  Sun Yuan;  An Qi;  Zhang Jie 收藏  |  浏览/下载：151/0  |  提交时间：2021/02/02 TiBw  Ti6Al4V composites  Inconel 718 alloys  interfacial reaction  heat transmission  microstructures   Wetting of liquid aluminum alloys on pure titanium at 873-973 K 期刊论文 Journal of Materials Research and Technology, 2019, 卷号: 8, 期号: 6, 页码: 5813-5822 作者:  Jin, Peng;  Liu, Yibo;  Sun, Qingjie;  Lin, Qiaoli;  Li, Junzhao 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Activation energy  Binary alloys  Drops  Intermetallics  Mass transfer  Oxide films  Silicon compounds  Titanium  Titanium dioxide  Wetting  Decomposition energy  Empirical equations  Gibbs energy of formation  Interfacial mass transfer  Intermetallic layer  Sessile drop method  Spreading dynamics  Viscous dissipation   Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590 作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue 收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02 Influence of Brazing Filler Zn on Microstructure and Properties of Titanium/Aluminum Joint by Friction Stir Brazing 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 9, 页码: 3067-3071 and 3100 作者:  Wu, Jingwei;  Zhang, Zhongke;  Che, Pengwei 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Aluminum compounds  Binary alloys  Brazing  Ductile fracture  Fillers  Friction  Friction stir welding  Intermetallics  Microstructure  Scanning electron microscopy  Spectrometers  Temperature distribution  Temperature measurement  Ternary alloys  Titanium compounds  Zinc  Zinc alloys  Brazing fillers  Cross section microstructure  Energy dispersive spectrometers  Friction stir  Highest temperature  Microstructure and properties  Peak temperatures  TC4 and Al6082   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15 Ultrasonic-assisted soldering  interfacial intermetallic compounds  microstructure  tin solder   Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 SAC305 lead-free solders  Interfacial reaction  Intermetallic compound  Shear strength  Fracture