CORC

在结果中检索

CORC

浏览/检索结果: 共103条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
From CuFeS2 to Ba6Cu2FeGe4S16: rational band gap engineering achieves large second-harmonic-generation together with high laser damage threshold 期刊论文
CHEMICAL COMMUNICATIONS, 2019, 卷号: 55, 期号: 96, 页码: 14510
作者:  Cao, Wangzhu;  Mei, Dajiang;  Yang, Yi;  Wu, Yuanwang;  Zhang, Lingyun
收藏  |  浏览/下载：94/0  |  提交时间：2019/12/31
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15
Hot compression deformation behavior of Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 157, 页码: 9
作者:  Wang, Cong;  Liu, Yunteng;  Lin, Tao;  Luo, Tianjiao;  Zhao, Yuhong
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
真空热处理提高烧结钕铁硼镀Cu层结合力的研究 期刊论文
表面技术, 2019, 卷号: 48, 期号: 10, 页码: 276-284
作者:  肖松;  杨杰;  张青科;  杨丽景;  宋振纶
收藏  |  浏览/下载：36/0  |  提交时间：2019/12/18
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Genesis of the Dachang Sn-polymetallic and Baoshan Cu ore deposits, and formation of a Cretaceous Sn-Cu ore belt from southwest China to western Myanmar 期刊论文
ORE GEOLOGY REVIEWS, 2019, 卷号: 112, 页码: 17
作者:  Huang, Wenting;  Liang, Huaying;  Zhang, Jian;  Wu, Jing;  Chen, Xilian
收藏  |  浏览/下载：27/0  |  提交时间：2020/04/27

©版权所有 ©2017 CSpace - Powered by CSpace