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兰州理工大学 [8]

金属研究所 [5]

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清华大学 [1]

大连理工大学 [1]

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	Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者: Zhang, Sinan; Wang Z(王臻); Wang, Jie; Duan GH(段桂花); Li, Haixia 收藏 \| 浏览/下载：20/0 \| 提交时间：2022/08/22 Cu/SAC305/Cu solder joints in situ tensile test fracture analysis X-ray mu-CT FE simulation
	Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Zhou, Liuru; Li, Qinglin 收藏 \| 浏览/下载：11/0 \| 提交时间：2020/06/16 Additives Atomic force microscopy Binary alloys Chlorine compounds Copper Copper compounds Electron probe microanalysis Electrons High resolution transmission electron microscopy Metallic films Scanning electron microscopy Tin alloys Tin metallography X ray photoelectron spectroscopy Crystallographic orientations Electron back scatter diffraction Electroplated copper film Electroplated Cu films Impurity incorporation Micro-structural characterization Microstructural instability Plating solutions
	Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者: Cao Lihua; Chen Yinbo; Shi Qiyuan; Yuan Jie; Liu Zhiquan 收藏 \| 浏览/下载：129/0 \| 提交时间：2021/02/02 alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者: Qiu, Hongyu; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：14/0 \| 提交时间：2019/11/15 Grain orientation Electromigration Intermetallic compounds Diffusion
	Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者: Hu, Xiaowu; Li, Chao; Li, Qinglin; Yi, Guangbin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 SAC305 lead-free solders Interfacial reaction Intermetallic compound Shear strength Fracture
	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Crystal orientation Deterioration Electrodes Substrates Thermoelectric equipment Aging treatment Brittle failures Cu electrodeposits Interfacial contact Isotropic microstructures Solder joints Spreadability Thermo-Electric materials
	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/11/15
	Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin; Zhou, Liuru 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Binary alloys Geometry Intermetallics Lead-free solders Morphology Polychlorinated biphenyls Silver compounds Soldered joints Tin alloys Aging time Compressive strain Enhanced effects Growth of intermetallics Kirkendall void Mean diameter Polyhedron shapes Solder joints
	Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin; Zhou, Liuru 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/11/15

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