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期刊论文 [21]
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:
Zhang, Huajin
;
Hu, Xiaowu
;
Liu, Yi
;
Zhang, Jiankang
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/03/01
Corrosion resistance
Corrosion resistant alloys
Corrosive effects
Ductile fracture
Electrochemical impedance spectroscopy
Galvanic corrosion
High temperature corrosion
Lead-free solders
Morphology
Tensile strength
Zinc
Zinc alloys
Corrosion behaviour
Electrochemical-impedance spectroscopies
Fracture morphology
Highest temperature
Lead-free solder alloy
Polarization impedance
Potentiodynamics polarization
Rich phase
Sm addition
Ultimate tensile strength
Reliability issues of lead-free solder joints in electronic devices
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Sun, Lei
;
Long, Wei-Min
收藏
  |  
浏览/下载:77/0
  |  
提交时间:2021/02/02
Lead-free solder
reliability
IMC
crack
failure
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy
期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:
Li, Jiayin
;
Hu, Xiaowu
;
Zhang, Xudong
;
Li, Qinglin
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/11/15
Zn-Sn alloys
mechanical properties
fracture analysis
microstructure refinement
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy
期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:
Li, Jiayin
;
Hu, Xiaowu
;
Zhang, Xudong
;
Li, Qinglin
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Aluminum
Binary alloys
Ductile fracture
Eutectics
Fracture mechanics
Lead-free solders
Mechanical properties
Microstructure
Tensile strength
Ternary alloys
Tin alloys
Eutectic structures
Fracture analysis
Lead-free solder alloy
Microstructure and mechanical properties
Microstructure refinement
Peritectic reaction
Ultimate tensile strength
Zn-Sn alloys
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
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  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint
期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914
作者:
Shi, Yu
;
Gao, Haiming
;
Li, Guang
;
Li, Xiang
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Binary alloys
Brazing
Diffusion
Dissimilar metals
Electric conductivity
Induction heating
Lead-free solders
Microstructure
Morphology
Plate metal
Steel
Structure (composition)
Tin alloys
Tin oxides
Welding
Welds
316 stainless steel
Connection strength
Copper steel
Diffusion reaction layer
Dissimilar metal welding
Electrical conductivity
High frequency induction brazing
Welding temperatures
Influence of RE and Ni on Microstructure and Properties of Zn20Sn High -temperature Lead-Free Solder
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 页码: 1860-1865
作者:
Li Xiaojun
;
Tian Jun
;
Dai Pinqiang
;
Wang Haiyan
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/21
Zn20Sn
lead-free solder
microstructure
properties
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:
Zhang, Q. K.
;
Hu, F. Q.
;
Song, Z. L.
;
Zhang, Z. F.
;
Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2018/01/10
Viscoplastic Creep
In-situ Ebsd
Polygonization
Grain Boundary Sliding
Strain Concentration
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Yang, Fan
;
Zhang, Liang
;
Liu, Zhi-quan
;
Zhong, Su Juan
;
Ma, Jia
;
Bao, Li
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2017/08/17
Sn-58Bi solder
lead-free solder
microstructure
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