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Effect of nickel on conductivity and corrosion of copper/stainless steel GTAW joints 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2019, 卷号: 40, 期号: 12, 页码: 53-58
作者:  Wang, Rui;  Shi, Yu;  Li, Guang;  Li, Chunkai;  Hou, Guoqing
收藏  |  浏览/下载:32/0  |  提交时间:2020/11/14
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载:1/0  |  提交时间:2020/11/14
Preliminary results of CuCrZr/316L tube-to-tube junctions fabricated with rotary friction welding 期刊论文
Fusion Engineering and Design, 2019, 卷号: 148
作者:  Wang, Minjing;  Zhao, Sixiang;  Wang, Wanjing;  Li, Qiang;  Luo, G.-N.
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
Semi-solid Microstructure Evolution of Mg-6Zn-1Cu-0.3Mn Magnesium Alloy 期刊论文
Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 10, 页码: 3441-3447
作者:  Huang, Xiaofeng;  Zhang, Qiaoqiao;  Ma, Yajie;  Wei, Langlang;  Yang, Jianqiao
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载:5/0  |  提交时间:2022/02/17
AuCu Alloy Nanoparticle Embedded Cu Submicrocone Arrays for Selective Conversion of CO2 to Ethanol 期刊论文
Small, 2019, 卷号: 15, 期号: 37
作者:  Shen, Sibo;  Peng, Xianyun;  Song, Lida;  Qiu, Yuan;  Li, Chao
收藏  |  浏览/下载:3/0  |  提交时间:2022/02/17
Microstructures and mechanical properties of A356/2024 bimetals fabricated by solid-liquid roll bonding 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 10
作者:  Luo, Xiaomei;  Chen, Tian-Ci;  Li, Yuan-Dong;  Zhou, Hongwei;  Bi, Guang-Li
收藏  |  浏览/下载:13/0  |  提交时间:2022/02/17
The joining behavior of titanium and Q235 steel joined by cold metal transfer joining technology 期刊论文
Materials, 2019, 卷号: 12, 期号: 15
作者:  Chang, Jinghuan
收藏  |  浏览/下载:6/0  |  提交时间:2020/11/14
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载:1/0  |  提交时间:2020/11/14
Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562
作者:  Wang, Haozhong;  Hu, Xiaowu;  Li, Qinglin;  Qu, Min
收藏  |  浏览/下载:5/0  |  提交时间:2019/11/15


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