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兰州理工大学 [18]
大连理工大学 [7]
北京航空航天大学 [3]
湖南大学 [2]
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期刊论文 [36]
发表日期
2019 [36]
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Effect of nickel on conductivity and corrosion of copper/stainless steel GTAW joints
期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2019, 卷号: 40, 期号: 12, 页码: 53-58
作者:
Wang, Rui
;
Shi, Yu
;
Li, Guang
;
Li, Chunkai
;
Hou, Guoqing
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2020/11/14
Chromium alloys
Chromium metallography
Copper corrosion
Corrosion
Corrosion resistance
Electric conductivity
Gas metal arc welding
Iron alloys
Iron metallography
Microcracks
Nickel
Nickel metallography
Scanning electron microscopy
Steel corrosion
Ternary alloys
316 L stainless steel
Acidic conditions
Electrical conductivity
Energy spectrometer
Gas tungsten arc welding
Inverse relationship
Metal conductivity
On conductivities
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
Preliminary results of CuCrZr/316L tube-to-tube junctions fabricated with rotary friction welding
期刊论文
Fusion Engineering and Design, 2019, 卷号: 148
作者:
Wang, Minjing
;
Zhao, Sixiang
;
Wang, Wanjing
;
Li, Qiang
;
Luo, G.-N.
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  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Copper alloys
Friction
Friction welding
Iron alloys
Joining
Microhardness
Tensile strength
Ternary alloys
Zircaloy
316L
CuCrZr
Divertor components
Oxide dispersion strengthened
Post-welding heat treatments
Room-temperature ductility
Rotary friction welding
Tube joining
Semi-solid Microstructure Evolution of Mg-6Zn-1Cu-0.3Mn Magnesium Alloy
期刊论文
Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 10, 页码: 3441-3447
作者:
Huang, Xiaofeng
;
Zhang, Qiaoqiao
;
Ma, Yajie
;
Wei, Langlang
;
Yang, Jianqiao
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  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Copper alloys
Grain boundaries
Heat treatment
Isotherms
Manganese alloys
Microstructure
Particle size
Remelting
Spheres
Zinc alloys
Average particle size
Heat preservation time
Heat treatment parameters
Isothermal heat treatments
Micro-structure evolutions
Ostwald ripening mechanism
Semi-solids
Spherical evolution
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:
Yu, Weiyuan
;
Liu, Yingzong
;
Liu, Yun
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  |  
浏览/下载:5/0
  |  
提交时间:2022/02/17
Binary alloys
Copper compounds
Interface states
Intermetallics
Lead-free solders
Microstructure
Phase interfaces
Soldering
Tin compounds
Ultrasonic effects
Unmanned aerial vehicles (UAV)
Formation and evolutions
Growth patterns
IMC layer
Interfacial intermetallics
Liquid interface
Nonequilibrium state
Ultrasonic vibration
AuCu Alloy Nanoparticle Embedded Cu Submicrocone Arrays for Selective Conversion of CO2 to Ethanol
期刊论文
Small, 2019, 卷号: 15, 期号: 37
作者:
Shen, Sibo
;
Peng, Xianyun
;
Song, Lida
;
Qiu, Yuan
;
Li, Chao
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2022/02/17
Binary alloys
Binding energy
Carbon dioxide
Copper
Electrocatalysis
Electrocatalysts
Ethanol
Ethylene
Gold
Nanoparticles
Potassium compounds
Alloy nanoparticle
CO2 reduction
Environmental crisis
Ethanol formation
Faradaic efficiencies
Renewable electricity
Research interests
Theoretical calculations
Microstructures and mechanical properties of A356/2024 bimetals fabricated by solid-liquid roll bonding
期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 10
作者:
Luo, Xiaomei
;
Chen, Tian-Ci
;
Li, Yuan-Dong
;
Zhou, Hongwei
;
Bi, Guang-Li
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/02/17
Alloying
Alloying elements
Aluminum alloys
Bimetals
Binary alloys
Copper alloys
Fabrication
Hardness
Interfaces (materials)
Liquids
Magnesium alloys
Microstructure
Phase interfaces
Preheating
Shear strength
Ternary alloys
Crystalline structure
Elemental distribution
Interfacial shear strength
Microstructures and mechanical properties
Pouring temperatures
Preheating temperature
Process parameters
Solid-liquid
The joining behavior of titanium and Q235 steel joined by cold metal transfer joining technology
期刊论文
Materials, 2019, 卷号: 12, 期号: 15
作者:
Chang, Jinghuan
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  |  
浏览/下载:6/0
  |  
提交时间:2020/11/14
Binary alloys
Copper alloys
Dissimilar metals
Filler metals
Iron alloys
Joining
Microhardness
Scanning electron microscopy
Spectrometers
Tensile strength
Titanium alloys
Welding
Welds
Cold metal transfers
Copper filler metal
Energy dispersive spectrometers
Interface reaction layer
Joining mechanisms
Microhardness tests
Strength
Welding parameters
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:
Sui, Ran
;
Li, Fuxiang
;
Ci, Wenjuan
;
Lin, Qiaoli
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Bismuth alloys
Copper
Copper oxides
Joining
Oxide films
Phase interfaces
Soldering
Ternary alloys
Tin compounds
Wetting
Cu intermetallics
IMC layer
Interfacial reactivity
Interfacial structures
Sessile drop method
Sn-Bi alloy
Spreading characteristics
Ternary phase diagrams
Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562
作者:
Wang, Haozhong
;
Hu, Xiaowu
;
Li, Qinglin
;
Qu, Min
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/15
Binary alloys
Coarsening
Copper
Growth rate
Morphology
Nanoparticles
Rate constants
Soldered joints
Tin alloys
Aging time
Cu substrate
IMC layer
Inhibition effect
Isothermal aging
Lead-free solder joint
Nanoparticle (NPs)
Solder joints
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