CORC

在结果中检索

CORC

浏览/检索结果: 共19条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K 期刊论文
Journal of Alloys and Compounds, 2018, 卷号: 767, 页码: 877-882
作者:  Lin, Qiaoli;  Li, Fuxiang;  Wang, Jianbin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder 期刊论文
Materials Science and Engineering A, 2018, 卷号: 729, 页码: 241-248
作者:  Xiao, Yong;  Li, Shan;  Wang, Ziqi;  Xi, Yong*;  Song, Zhipeng
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/04
Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer 期刊论文
Ultrasonics Sonochemistry, 2018, 卷号: 45, 页码: 223-230
作者:  Xiao, Yong;  Wang, Qiwei;  Wang, Ling;  Zeng, Xian*;  Li, Mingyu
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/04
Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: Vol.729, 页码: 241-248
作者:  Yong Xiao;  Shan Li;  Ziqi Wang;  Zhipeng Song;  Yongning Mao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/26
Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 1931-1936
作者:  Zhao, N.;  Deng, J. F.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6
作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Latest advances of X-ray imaging and biomedical applications beamline at SSRF 期刊论文
NUCLEAR SCIENCE AND TECHNIQUES, 2015, 卷号: 26, 期号: 2, 页码: —
作者:  Xie, HL;  Deng, B;  Du, GH;  Fu, YN;  Chen, RC
收藏  |  浏览/下载：37/0  |  提交时间：2015/12/09
In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 467-474
作者:  Qu, Lin;  Zhao, Ning;  Ma, Haitao;  Zhao, Huijing;  Huang, Mingliang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
F. F. Tian; Z. Q. Liu
收藏  |  浏览/下载：34/0  |  提交时间：2014/03/14

©版权所有 ©2017 CSpace - Powered by CSpace