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	Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder
	Xiao, Yong; Li, Shan; Wang, Ziqi; Xi, Yong*; Song, Zhipeng; Mao, Yongning; Li, Mingyu
刊名	Materials Science and Engineering A
	2018
卷号	729页码:241-248
关键词	7075-Al alloy Ni-Sn composite solder Ultrasound-assisted soldering Microstructure Interfacial reaction Mechanical properties
ISSN号	0921-5093
DOI	10.1016/j.msea.2018.05.015
URL标识	查看原文
WOS记录号	WOS:000439675100028;EI:20182205247505
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3384638
专题	武汉理工大学
作者单位	1.[Song, Zhipeng 2.Li, Shan 3.Xiao, Yong 4.Xi, Yong 5.Mao, Yongning] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Hubei, Peoples R China.
推荐引用方式 GB/T 7714	Xiao, Yong,Li, Shan,Wang, Ziqi,et al. Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder[J]. Materials Science and Engineering A,2018,729:241-248.
APA	Xiao, Yong.,Li, Shan.,Wang, Ziqi.,Xi, Yong*.,Song, Zhipeng.,...&Li, Mingyu.(2018).Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder.Materials Science and Engineering A,729,241-248.
MLA	Xiao, Yong,et al."Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder".Materials Science and Engineering A 729(2018):241-248.

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