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	Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration
	Zhao, N.; Deng, J. F.; Zhong, Y.; Huang, M. L.; Ma, H. T.
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2017
卷号	46页码:1931-1936
关键词	Soldering thermomigration interfacial reaction intermetallic compound Sn-9Zn dissolution
ISSN号	0361-5235
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3282757
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Zhao, N.,Deng, J. F.,Zhong, Y.,et al. Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration[J]. JOURNAL OF ELECTRONIC MATERIALS,2017,46:1931-1936.
APA	Zhao, N.,Deng, J. F.,Zhong, Y.,Huang, M. L.,&Ma, H. T..(2017).Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration.JOURNAL OF ELECTRONIC MATERIALS,46,1931-1936.
MLA	Zhao, N.,et al."Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration".JOURNAL OF ELECTRONIC MATERIALS 46(2017):1931-1936.

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