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	In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process
	Qu, Lin; Zhao, Ning; Ma, Haitao; Zhao, Huijing; Huang, Mingliang
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2015
卷号	44页码:467-474
关键词	Soldering electromigration interfacial reaction current density in situ observation FEM
ISSN号	0361-5235
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4405154
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China.
推荐引用方式 GB/T 7714	Qu, Lin,Zhao, Ning,Ma, Haitao,et al. In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process[J]. JOURNAL OF ELECTRONIC MATERIALS,2015,44:467-474.
APA	Qu, Lin,Zhao, Ning,Ma, Haitao,Zhao, Huijing,&Huang, Mingliang.(2015).In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process.JOURNAL OF ELECTRONIC MATERIALS,44,467-474.
MLA	Qu, Lin,et al."In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process".JOURNAL OF ELECTRONIC MATERIALS 44(2015):467-474.

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