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兰州理工大学 [64]

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期刊论文 [56]

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限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate 期刊论文 APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8 作者: Yu, Weiyuan; Wang, Mingkang; Wang, Fengfeng; Wang, Xiwushan; Wu, Baolei 收藏 \| 浏览/下载：13/0 \| 提交时间：2022/07/19 Droplet impaction Droplet solidification Dynamic wetting behavior Thermal spraying Jet formation
	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Spreading behavior of Sn droplets impacting Cu and stainless steel substrates 期刊论文 SURFACES AND INTERFACES, 2022, 卷号: 29 作者: Wang, Xiwushan; Yu, Weiyuan; Wang, Mingkang; Wang, Fengfeng; Wu, Baolei 收藏 \| 浏览/下载：13/0 \| 提交时间：2022/04/21 Metal droplets Droplet impinging Spreading Droplet diameter Contact angle
	Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wu, Baolei; Wang, Yanhong 收藏 \| 浏览/下载：19/0 \| 提交时间：2022/06/20 Copper Intermetallics Nanocomposites Precipitation (chemical) Ultrasonic applications Ultrasonic waves Wetting Cu substrate Direct current method Direct-current Driving forces Intermetallics compounds Liquid solders Power current Ultrasonic-vibration Wetting balance Wetting behavior
	Effect of Anodizing Treatment on Ultrasonic Welding 6063 Aluminum Alloy and PPS 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 1, 页码: 241-248 作者: Yu, Weiyuan; Zhang, Tao; Wang, Youliang 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/04/21 Aluminum alloys Chemical bonds Porosity Sulfur compounds Ultrasonic welding Ultrasonics 6063 aluminium alloys Anodizing treatment Polyphenylene sulfides Polyphenylene sulphide Porous structures Shear strength of joint Ultrasonic weldings Welding method Welding pressure Welding time
	Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009 作者: Yu Weiyuan; Yang Guoqing; Sun Xuemin; Wang Fengfeng; Zhang Tao 收藏 \| 浏览/下载：9/0 \| 提交时间：2022/03/01 ALTSAB anodic bonding soldering float glass Kovar
	Review on Joining Technology of Aluminum Alloy and Resin Matrix Composites 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 3, 页码: 753-761 作者: Wang Youliang; Zhang Tao; Yu Weiyuan; Zhang Wenjuan 收藏 \| 浏览/下载：5/0 \| 提交时间：2021/06/03 composites aluminum alloys processing technology strength connection
	Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wang, Yanhong 收藏 \| 浏览/下载：13/0 \| 提交时间：2021/03/02 Copper Tin Ultrasonic effects Ultrasonic testing Ultrasonic waves Wetting Acoustic cavitations Additional forces Copper substrates Cross-section morphology Interfacial atoms Ultrasonic sound Ultrasonic vibration Wetting balance methods
	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者: Yu, Weiyuan; Sun, Jungang; Liu, Yun; B., Wu; Z., Lei 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：2/0 \| 提交时间：2022/02/17 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution

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