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浏览/检索结果: 共2条，第1-2条 帮助 限定条件 发表日期：2022     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang 收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin 收藏  |  浏览/下载：27/0  |  提交时间：2022/03/01 Corrosion resistance  Corrosion resistant alloys  Corrosive effects  Ductile fracture  Electrochemical impedance spectroscopy  Galvanic corrosion  High temperature corrosion  Lead-free solders  Morphology  Tensile strength  Zinc  Zinc alloys  Corrosion behaviour  Electrochemical-impedance spectroscopies  Fracture morphology  Highest temperature  Lead-free solder alloy  Polarization impedance  Potentiodynamics polarization  Rich phase  Sm addition  Ultimate tensile strength