Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn

	Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn
	Liu, Yun; Yu, Weiyuan; Sun, Jungang; Sun, Xuemin; Wang, Fengfeng
刊名	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
	2020-07-01
卷号	49 期号:7 页码:2365-2371
关键词	Binary alloys Dissolution Nickel Tin Ultrasonic effects Acceleration behavior Dissolution behavior Holding time Molten solders Rod-shaped Subsequent cooling Ultrasonic cavitation Ultrasonic vibration
ISSN号	1002185X
英文摘要	The dissolution behavior of Ni in molten Sn solder with and without applied ultrasonic vibration (USV) was investigated by the immersion experiment. In order to reveal the mechanism of accelerated dissolution by USV, the ultrasonic pressure distribution in molten solder was simulated by finite element analysis and the microstructures after dissolution were observed. The results show the dissolution amount of Ni in Sn after 10 s of USV is equivalent to that of a holding time of 5 min without USV. Without USV, the interfacial IMC gradually thicken as the holding time increases, which hinders the diffusion of Ni atoms into the Sn solder. With USV, ultrasonic cavitation causes the infinite dissolution of Ni into Sn solder. Furthermore, the dissolved Ni atom at the interface is brought rapidly to the molten solder by the ultrasonic streaming, which causes a large number of elongated rod-shaped Ni3Sn4 precipitated during the subsequent cooling process. © 2020, Science Press. All right reserved.
语种	中文
出版者	Science Press
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115113]
专题	实验室建设与管理处
作者单位	State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Liu, Yun,Yu, Weiyuan,Sun, Jungang,et al. Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(7):2365-2371.
APA	Liu, Yun,Yu, Weiyuan,Sun, Jungang,Sun, Xuemin,&Wang, Fengfeng.(2020).Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(7),2365-2371.
MLA	Liu, Yun,et al."Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.7(2020):2365-2371.