Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint | |
Jin, Yuhua1,2; Wu, Bo1,2; Lu, Xuetian1,2; Xing, Yichu1,2; Zhou, Zizheng1,2 | |
刊名 | Materials |
2020-10-02 | |
卷号 | 13期号:20页码:1-17 |
关键词 | Aluminum Aluminum alloys Annealing Binary alloys Copper Copper alloys Friction Intermetallics Microstructure Research laboratories Welds Annealing temperatures Friction stir welded joints Growth mechanisms Interface mi-crostructure Layered Structures Original structures Post-weld annealing Softening phenomenon |
DOI | 10.3390/ma13204591 |
英文摘要 | Friction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir welding was studied. The growth mechanism of the intermetallic compound (IMC) layer in the Cu-Al lap joint was revealed by annealing at 300, 350, 400C. The intermetallic compound (IMC) layer in the lap joint grows again during annealing, and only the original structure of the intermetallic compound (IMC) layer grows at lower annealing temperature and holding time. At higher annealing temperature and holding time, the original structure of intermetallic compound (IMC) layer no longer grows, and a new layered structure appears in the middle of the original structure. There is a gradient change of microhardness in the nugget zone. With different holding times, different softening phenomena appear in the metals on both sides of copper and aluminum. When the hardness decreases to a certain extent, it will not continue to decrease with the increase of holding time. When the annealing temperature is 350C and 400C, the strength of the tensile sample increases first and then decreases with the increase of holding time. At the interface of Cu-Al, the fracture runs through the whole intermetallic compound (IMC) layer. © 2020 by the authors. Licensee MDPI, Basel, Switzerland. |
WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
语种 | 英语 |
出版者 | MDPI AG |
WOS记录号 | WOS:000585577200001 |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/114998] |
专题 | 材料科学与工程学院 |
作者单位 | 1.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou; 730050, China; 2.School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou; 730050, China |
推荐引用方式 GB/T 7714 | Jin, Yuhua,Wu, Bo,Lu, Xuetian,et al. Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint[J]. Materials,2020,13(20):1-17. |
APA | Jin, Yuhua,Wu, Bo,Lu, Xuetian,Xing, Yichu,&Zhou, Zizheng.(2020).Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint.Materials,13(20),1-17. |
MLA | Jin, Yuhua,et al."Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint".Materials 13.20(2020):1-17. |
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