Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations

doi:10.1016/j.msea.2020.139589

	Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
	Bi, Xiaoyang 2; Hu, Xiaowu 2; Li, Qinglin 1
刊名	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
	2020-06-24
卷号	788
关键词	Solder joints Ni-Co film Shear strength Atomic model Intermetallic compound First-principles calculations
ISSN号	0921-5093
DOI	10.1016/j.msea.2020.139589
英文摘要	Depositing Ni-based films on Cu pads has been accepted as an effective strategy to address the reliability challenges due to the development of plastic ball grid array (PBGA) in electronic packaging technology. Modification mechanisms of Co on Ni film and Sn-37 wt%Pb/Ni/Cu solder joints were researched from experimental and theoretical methods in this work. Experimental results suggested the additional minor Co element (12.46 at. %) led to the formation of Ni-Co solid solution. After reflowing, Ni3Sn4 intermetallic compound (IMC) was formed within Sn-37Pb/Ni/Cu system while (Ni,Co)(3)Sn-4 IMC was produced at solder/Ni-Co interface. N-anoindentation tests indicated that the doping of Co enhanced the mechanical properties of Ni film and Ni3Sn4 IMC. Our single-lap shear tests demonstrated that the shear strength of Sn-37Pb/Ni/Cu reflowing joints increased from 24.68 to 29.72 MPa with the addition of Co. Moreover, theoretical investigations based on first-principles calculations were carried out to uncover the Co strengthening mechanism. The calculated results noted that the improved stability of coating/IMC interface and mechanical properties of coating and IMC phases were the main reasons for the enhanced shear strength of Sn-37Pb/Ni-Co/Cu solder joints.
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	ELSEVIER SCIENCE SA
WOS记录号	WOS:000541749700054
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/155159]
专题	材料科学与工程学院
作者单位	1.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China 2.Nanchang Univ, Sch Mech & Elect Engn, Nanchang 330031, Jiangxi, Peoples R China;
推荐引用方式 GB/T 7714	Bi, Xiaoyang,Hu, Xiaowu,Li, Qinglin. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,788.
APA	Bi, Xiaoyang,Hu, Xiaowu,&Li, Qinglin.(2020).Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,788.
MLA	Bi, Xiaoyang,et al."Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 788(2020).