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Design and Control of an Underactuated Finger Exoskeleton for Assisting Activities of Daily Living
期刊论文
IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2021, 页码: 11
作者:
Li, Houcheng
;
Cheng, Long
;
Sun, Ning
;
Cao, Ran
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2022/01/27
Exoskeletons
Grasping
Electronics packaging
Kinematics
Senior citizens
Robots
Shape
Admittance control
assistance
finger exoskeleton
preshaping
shape-adaptive grasping
underactuation
Design and Validation of a Self-Aligning Index Finger Exoskeleton for Post-Stroke Rehabilitation
期刊论文
IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, 2021, 卷号: 29, 页码: 1513-1523
作者:
Sun, Ning
;
Li, Guotao
;
Cheng, Long
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2021/11/02
Exoskeletons
Indexes
Kinematics
Training
Force
Electronics packaging
Task analysis
Finger exoskeleton
self-aligning mechanism
kinematic compatibility
kineto-statics
The oxidation effect on the cracking behavior of a Co-based alloy under thermal shocks
期刊论文
Corrosion Science, 2020, 卷号: 173
作者:
Wen, Junxia
;
Cao, Rui
;
Che, Hongyan
;
Dong, Hao
;
Zhang, Haiyan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Cracks
Electronics packaging
Oxidation
Thermal expansion
Thermal shock
Co-based alloys
Coefficients of thermal expansions
Cracking behavior
Oxidation behaviors
Oxidation effects
Sample surface
Static conditions
Volume change
A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules
会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:
Tian, Jun
;
Wang, Congsi
;
Liu, Shaoyi
;
Zhu, Cheng
;
Zhou, Cheng
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/07/06
Microwave circuits
Belts
Electronics packaging
Flexible electronics
Gold
Integrated circuit interconnects
Microwaves
Timing circuits
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
期刊论文
Materials and Design, 2020, 卷号: 188
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shock
Carbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
会议论文
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/12/18
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shockCarbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
Kinetics of dissolution of copper in liquid tin with ultrasonic waves
期刊论文
Materials Research, 2020, 卷号: 23, 期号: 1
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Electronics packaging
Liquids
Tin
Ultrasonic waves
Dissolution behavior
Dissolution rates
Electronic Packaging
IMC layer
Immersion method
Immersion time
Ultrasonic power
Welding method
Kinetics of dissolution of copper in liquid tin with ultrasonic waves
期刊论文
Materials Research, 2020, 卷号: 23, 期号: 1
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2022/02/18
Activation energy
Copper
Electronics packaging
Liquids
Tin
Ultrasonic waves
Fracture performance test of wave transparent brittle materials of hypersonic vehicle under high-heat-flow thermal shock [高超声速飞行器脆性透波材料大热流冲击下断裂性能试验]
期刊论文
Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2019, 卷号: 40
作者:
Wu, D.
;
Lin, L.
;
Ren, H.
;
Zhu, F.
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/30
Alumina
Aluminum oxide
Antennas
Brittleness
Correlation methods
Electronics packaging
Fracture
Heat flux
Hypersonic aerodynamics
Image analysis
Infrared radiation
Locks (fasteners)
Silica
Speckle
Strain measurement
Thermal shock
Vehicle performance
Digital image correlation methods
Fracture performance
Fracture time
Location detection
Maximum heat flux
Reliability design
Shock simulation
Wave-transparent
Hypersonic vehicles
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