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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:   收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder 期刊论文 Materials Science and Engineering A, 2018, 卷号: 729, 页码: 241-248 作者:  Xiao, Yong;  Li, Shan;  Wang, Ziqi;  Xi, Yong*;  Song, Zhipeng 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/04 7075-Al alloy  Ni-Sn composite solder  Ultrasound-assisted soldering  Microstructure  Interfacial reaction  Mechanical properties   Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: Vol.729, 页码: 241-248 作者:  Yong Xiao;  Shan Li;  Ziqi Wang;  Zhipeng Song;  Yongning Mao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/26 7075-Al  alloy  Ni-Sn  composite  solder  Ultrasound-assisted  soldering  microstructure  interfacial  reaction  mechanical  properties   Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04 ultrasonic vibration  intermetallic compound  Ni-Sn composite solder  microstructure  shear strength   Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders 期刊论文 Ceramics International, 2017, 卷号: 43, 期号: 16, 页码: 14314-14320 作者:  Xiao, Yong;  Zhang, Yuanqi;  Zhao, Kai;  Li, Shan;  Wang, Ling 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04 Alumina  Ultrasonic vibration  Ni-foam  Sn-based solder  Microstructure  Mechanical properties