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CORC

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Highly thermal-conductive graphite flake/Cu composites prepared by sintering intermittently electroplated core-shell powders 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 61, 页码: 93-99
作者:  Sun, Hong;  Deng, Nan;  Li, Jianqiang;  He, Gang;  Li, Jiangtao
收藏  |  浏览/下载：28/0  |  提交时间：2021/03/29
Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters 期刊论文
JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216
作者:  Robertson, Stuart;  Doak, Scott;  Sun, Fu-Long;  Liu, Zhi-Quan;  Liu, Changqing
收藏  |  浏览/下载：28/0  |  提交时间：2021/02/02
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16
Effect of Cryogenic Treatment on Extruded Copper Structures 会议论文
Jiaozuo, China, September 20, 2019 - September 22, 2019
作者:  Shengquan, Zhang;  Bing, Wang;  Shizhuo, Wang;  Changzhong, Zhao;  Xijing, Wang
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7
作者:  Sun, Hong;  Guo, Lijiang;  Deng, Nan;  Li, Xiaoyu;  Li, Jiangtao
收藏  |  浏览/下载：90/0  |  提交时间：2019/11/12
Preparation and Characterization of Ni-coated Carbon Fiber Reinforced Cu-based Composites 期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 7, 页码: 2462-2466
作者:  Jia, Jiangang;  Gao, Changqi;  Liu, Diqiang;  Ji, Genshun;  Xue, Xiangjun
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Explore of warpage origination in wlp and processing influence factors by experiment and theoretical modeling 期刊论文
Journal of materials science-materials in electronics, 2016, 卷号: 27, 期号: 11, 页码: 11548-11555
作者:  Li, Heng;  Cheng, Gong;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：17/0  |  提交时间：2019/05/09
Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite 期刊论文
Journal of materials science-materials in electronics, 2016, 卷号: 27, 期号: 8, 页码: 8325-8331
作者:  Li, Heng;  Cheng, Gong;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：21/0  |  提交时间：2019/05/09

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