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	Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite
	Li, Heng1,2; Cheng, Gong1,2; Xu, Gaowei1; Luo, Le1
刊名	Journal of materials science-materials in electronics
	2016-08-01
卷号	27期号:8页码:8325-8331
ISSN号	0957-4522
DOI	10.1007/s10854-016-4841-6
通讯作者	Luo, le(leluo@mail.sim.ac.cn)
英文摘要	Polyimide(pi)/cu composite thick films are widely used in wafer level packaging (wlp), and a common problem is the defects such as void, delamination, crack or wafer warpage induced by thermal stress. compared with traditional rigid substrate/cu/passivation system, pi imposes quite a different boundary constraint on cu, resulting in a special stress evolution, and the corresponding mechanism is far from fully understood. five sets of composites are constructed to investigate the influence of pi on thermal stress evolution in cu film by means of in situ wafer warpage measurement under thermal cycling. together with finite element analyses, it's counterintuitive to find that although pi indeed reduces the stress in cu, it exacerbates overall wafer warpage at room temperature. warpage evolution reveals that composites consisting of substrate/pi/cu sustains a moderate compressive stress while bare pi film is totally stress relaxed at high temperature, indicating that cu and pi restrains stress relaxation reciprocally. it suggests that mutual effect should be considered when evaluating the stress distribution in polymer-metal composite thick films.
WOS关键词	ELECTROPLATED CU FILMS ; COPPER-FILMS ; DIFFUSIONAL CREEP ; RESIDUAL-STRESS ; RELAXATION ; DEFORMATION ; PASSIVATION ; WARPAGE ; STRAIN
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000379803200081
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2375104
专题	中国科学院大学
通讯作者	Luo, Le
作者单位	1.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
推荐引用方式 GB/T 7714	Li, Heng,Cheng, Gong,Xu, Gaowei,et al. Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite[J]. Journal of materials science-materials in electronics,2016,27(8):8325-8331.
APA	Li, Heng,Cheng, Gong,Xu, Gaowei,&Luo, Le.(2016).Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite.Journal of materials science-materials in electronics,27(8),8325-8331.
MLA	Li, Heng,et al."Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite".Journal of materials science-materials in electronics 27.8(2016):8325-8331.

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