CORC

在结果中检索

CORC

浏览/检索结果: 共15条，第1-10条 帮助

限定条件        
已选(0)清除 条数/页：   排序方式：
An efficient and stable Cu/SiO2 catalyst for the syntheses of ethylene glycol and methanol via chemoselective hydrogenation of ethylene carbonate 会议论文
Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai, PEOPLES R CHINA, JUL 17-21, 2017
作者:  Liu, Jiaju;  He, Peng;  Wang, Liguo;  Liu, Hui;  Cao, Yan
收藏  |  浏览/下载：23/0  |  提交时间：2019/06/21
Microstructure Evolution of Cu-15Ni-8Sn Alloy Prepared by Vertical Semi-continuous Casting with EMS 会议论文
9TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC PROCESSING OF MATERIALS (EPM2018), 2018-01-01
作者:  Guo, Zhongkai;  Jie, Jinchuan;  Yue, Shipeng;  Li, Tingju;  Guo, Qingtao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Electromagnetic Field on Microstructure and Properties of Cu-Cr-Co-Si Alloy 会议论文
9TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC PROCESSING OF MATERIALS (EPM2018), 2018-01-01
作者:  Sun, Xinglong;  Jie, Jinchuan;  Li, Tingju
收藏  |  浏览/下载：116/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kuang, Jiameng;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Effect of In addition on the properties of Sn-Au-Cu lead-free solder 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yin, Siqi;  Huang, Mingliang;  Chen, Yu
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Study on Electrochemical Migration of Sn-0.7Cu 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Qi, Xiao;  Ma, Haoran;  Huang, Ru;  Yao, Jinye;  Shang, Shengyan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Mechanistic investigation on tuning the conductivity type of cuprous oxide (Cu2O) thin films via deposition potential 会议论文
作者:  Han, Juan;  Chang, Jing;  Wei, Rong;  Ning, Xiaohui;  Li, Jian
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/26

©版权所有 ©2017 CSpace - Powered by CSpace