| Effect of In addition on the properties of Sn-Au-Cu lead-free solder | |
| Yin, Siqi; Huang, Mingliang; Chen, Yu | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | Sn-Au solder Sn-Au-Cu-In microstructure mechanical properties cluster-phis-glue-atom model |
| 页码 | 1363-1367 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253350 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yin, Siqi,Huang, Mingliang,Chen, Yu. Effect of In addition on the properties of Sn-Au-Cu lead-free solder[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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