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大连理工大学 [10]
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武汉大学 [2]
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期刊论文 [18]
会议论文 [7]
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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
作者:
Du, Yahong
;
Gao, Li-Yin
;
Yu, Daquan
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2021/02/03
Imparting designer biorecognition functionality to metal-organic frameworks by a dna-mediated surface engineering strategy
期刊论文
Small, 2018, 卷号: 14, 期号: 11, 页码: 8
作者:
Ning, Weiyu
;
Di, Zhenghan
;
Yu, Yingjie
;
Zeng, Pingmei
;
Di, Chunzhi
收藏
  |  
浏览/下载:93/0
  |  
提交时间:2019/04/23
Biorecognition
Dna
Metal-organic frameworks
Surface engineering
Mode splitting induced by an arbitrarily shaped Rayleigh scatterer in a whispering-gallery microcavity
期刊论文
Physical Review A, 2018, 卷号: 97, 期号: 6, 页码: 063828
作者:
Yinglun Xu
;
Shui-Jing Tang
;
Xiao-Chong Yu
;
You-Ling Chen
;
Daquan Yang
;
Qihuang Gong
;
Yun-Feng Xiao
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2019/11/12
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs
会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:
Yao, Mingjun
;
Zhao, Ning
;
Yu, Daquan
;
Xiao, Zhiyi
;
Ma, Haitao
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Yao, Mingjun
;
Zhao, Ning
;
Yu, Daquan
;
Xiao, Zhiyi
;
Ma, Haitao
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
3D IC
wafer-level hybrid bonding
insert Cu pillar solder bump
dry film adhesive
TSVs
reliability
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:
Yao, Mingjun
;
Zhao, Ning
;
Wang, Teng
;
Yu, Daquan
;
Xiao, Zhiyi
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/12/02
3D IC
micro-bump
B-stage adhesive film
wafer-level hybrid bonding
via-last TSVs
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:
Yao, Mingjun
;
Zhao, Ning
;
Wang, Teng
;
Yu, Daquan
;
Xiao, Zhiyi
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/02
3-D IC
bump
dry film adhesive
wafer-level hybrid bonding
Performance evaluation of asphalt mixtures containing recycled concrete aggregates
期刊论文
INTERNATIONAL JOURNAL OF PAVEMENT ENGINEERING, 2018, 卷号: 19, 页码: 422-428
作者:
Sun Daquan
;
Tian Yang
;
Sun Guoqiang
;
Pang Qi
;
Yu Fan
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
Recycled concrete aggregate
asphalt mixture
mechanical property
pavement performance
strength
Synthesis, characterization and in vitro/in vivo evaluation of novel reduction-sensitive hybrid nano-echinus-like nanomedicine
期刊论文
ARTIFICIAL CELLS NANOMEDICINE AND BIOTECHNOLOGY, 2018, 卷号: 46, 页码: 1-9
作者:
Wang, Kaili
;
Guo, Chunjing
;
Zou, Shaohua
;
Yu, Yueming
;
Fan, Xinxin
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/11
Nano-echinus-like nanomedicine
hybrid carbohydrate polymer
reduction-sensitive
oligo-hyaluronan
controlled drug delivery
Modification Effect of Lime Soil and Cement Soil by Water-Reducing Agent
期刊论文
2017, 卷号: 20, 页码: 283-287
作者:
Yu, Fan[1,2]
;
Huang, Yubin[2]
;
Sun, Daquan[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/30
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