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CORC

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CO2-Rich Rejuvenated Stage Lavas on Hawaiian Islands 期刊论文
GEOCHEMISTRY GEOPHYSICS GEOSYSTEMS, 2022, 卷号: 23, 期号: 9, 页码: 17
作者:  Zhang, Guoliang;  Wang, Shuai;  Huang, Shichun;  Zhan, Mingjun;  Yao, Junhua
收藏  |  浏览/下载：14/0  |  提交时间：2023/01/06
Operations of the LHAASO-WCDA 会议论文
Berlin, Germany, 2021
作者:  Liu, Cheng;  Chen, Mingjun;  Gu, Minghao;  You, Xiaohao;  Li, Huicai
收藏  |  浏览/下载：11/0  |  提交时间：2022/02/24
Topological graphic passwords made by series sun-graphs on odd-graceful property 会议论文
Chongqing, China, May 24, 2019 - May 26, 2019
作者:  Yang, Sihua;  Zhang, Mingjun;  Yao, Bing;  Guo, Jingxia;  Bai, Zhongyu
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15
Detection of heavy metals in water samples by laser-induced breakdown spectroscopy combined with annular groove graphite flakes 期刊论文
PLASMA SCIENCE & TECHNOLOGY, 2019, 卷号: 21, 期号: 3, 页码: 7
作者:  Fang, Li;  Zhao, Nanjing;  Ma, Mingjun;  Meng, Deshuo;  Jia, Yao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/25
A study on the impact of the LHAASO-WCDA photomultiplier tube afterpulse 会议论文
Madison, WI, United states, 2019
作者:  Chen, Baomin;  Gao, Bo;  Zha, Min;  Yao, Zhiguo;  Chen, Mingjun
收藏  |  浏览/下载：4/0  |  提交时间：2022/02/24
Online calibration of laser-induced breakdown spectroscopy for detection of heavy metals in water 期刊论文
PLASMA SCIENCE & TECHNOLOGY, 2018, 卷号: 20, 期号: 9, 页码: 6
作者:  Jia, Yao;  Zhao, Nanjing;  Fang, Li;  Ma, Mingjun;  Meng, Deshuo
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/11
Exacerbated grassland degradation and desertification in Central Asia during 2000-2014 期刊论文
ECOLOGICAL APPLICATIONS, 2018, 卷号: 28, 期号: 2, 页码: 442-456
作者:  Zhang, Geli;  Biradar, Chandrashekhar M.;  Xiao, Xiangming;  Dong, Jinwei;  Zhou, Yuting
收藏  |  浏览/下载：27/0  |  提交时间：2019/05/30
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02

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