| Mechanism of Cu5Zn8 layer act as a diffusion barrier layer | |
| Yao, Jinye; Li, Hua; Huang, Ru; Qi, Xiao; Wang, Boyin; Qiao, Junshan; Wang, Yunpeng; Ma, Haitao | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | Cu5Zn8 interfacial intermetallic compounds lead-free solder growth kinetics |
| 页码 | 383-386 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253361 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Dept Mat Sci & Engn, Dalian, Peoples R China. 2.Dalian Univ Technol, Sch Mech Engn, 2 Ling Gong Rd, Dalian, Liaoning, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yao, Jinye,Li, Hua,Huang, Ru,et al. Mechanism of Cu5Zn8 layer act as a diffusion barrier layer[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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