| Study on Electrochemical Migration of Sn-0.7Cu | |
| Qi, Xiao; Ma, Haoran; Huang, Ru; Yao, Jinye; Shang, Shengyan; Anil; Wang, Yunpeng; Ma, Haitao | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | electronic packaging SEM Sn0.7Cu deposits electrochemical migration EDS XRD |
| 页码 | 387-390 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253356 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Qi, Xiao,Ma, Haoran,Huang, Ru,et al. Study on Electrochemical Migration of Sn-0.7Cu[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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