| Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs | |
| Yao, Mingjun; Zhao, Ning; Yu, Daquan; Xiao, Zhiyi; Ma, Haitao | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | 3D IC wafer-level hybrid bonding insert Cu pillar solder bump dry film adhesive TSVs reliability |
| 页码 | 241-246 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253321 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. 2.Huatian Technol Kunshan Elect Co, Kunshan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yao, Mingjun,Zhao, Ning,Yu, Daquan,et al. Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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