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科研机构
兰州理工大学 [18]
金属研究所 [6]
内容类型
期刊论文 [24]
发表日期
2020 [24]
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Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:
Yu, Weiyuan
;
Sun, Jungang
;
Liu, Yun
;
B., Wu
;
Z., Lei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Brazing
Brazing filler metals
Grain size and shape
Intermetallics
Melting point
Microstructure
Nanoparticles
Synthesis (chemical)
Brazing joints
Composite solders
Crystal planes
Driving forces
Interfacial intermetallics
Liquidus temperature
Melting process
Melting properties
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint
期刊论文
Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17
作者:
Jin, Yuhua
;
Wu, Bo
;
Lu, Xuetian
;
Xing, Yichu
;
Zhou, Zizheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum
Aluminum alloys
Annealing
Binary alloys
Copper
Copper alloys
Friction
Intermetallics
Microstructure
Research laboratories
Welds
Annealing temperatures
Friction stir welded joints
Growth mechanisms
Interface mi-crostructure
Layered Structures
Original structures
Post-weld annealing
Softening phenomenon
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:
Liu, Zhi-Quan
;
Meng, Zhi-Chao
;
Wu, Di
;
Shang, Zhengang
;
He, Xin
收藏
  |  
浏览/下载:70/0
  |  
提交时间:2021/02/02
Co sputtering target
Soldering assembly
Interface
IMC
Growth mechanism
Kinetics of Copper Dissolution in Liquid Tin by Direct Current
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 10, 页码: 3425-3432
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
;
Liu, Yun
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Rate constants
Tin
Comsol multiphysics
Copper dissolution
Direct current
Dissolution kinetics
Dissolution rates
Effective charge
Immersion method
Temperature range
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs
期刊论文
Vacuum, 2020, 卷号: 180
作者:
Qiu, Hongyu
;
Hu, Xiaowu
;
Li, Shuang
;
Wan, Yongqiang
;
Li, Qinglin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Copper alloys
Elastic moduli
Fracture
Fracture mechanics
Shear flow
Soldered joints
Surface analysis
Tin alloys
Area ratios
Fracture mechanisms
Fracture surface analysis
Fracture surfaces
Fractured surfaces
Isothermal aging
Lead-free solder joint
Solder joints
The effect of finish layer on the interfacial cracking failure of Au-Si bonding
期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
AuSi bonding
NiCo
Intermetallic compounds (IMCs)
Failure analysis
Crack
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion barriers
Gold
Gold compounds
Heat resistance
Microstructure
Nickel
Open circuit voltage
Soldering
Barrier films
Diffusion barrier films
Electrical resistances
Output current
Reflow--soldering
Solder joints
Temperature differences
Thermoelectric
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion
Electric resistance
Electrodes
Growth rate
IV-VI semiconductors
Microstructure
Scanning electron microscopy
Tin
Tin compounds
Transmission electron microscopy
Diffusion process
Electrical resistances
Micro-structure evolutions
Porous structures
Thermodynamically stable
Thermoelectric
Volume diffusion
X ray diffractometers
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