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浏览/检索结果:
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Influence mechanism of AlCoCrFeNi content on the wide temperature domain tribological properties of WC-based cemented carbides
期刊论文
International Journal of Refractory Metals and Hard Materials, 2023, 卷号: 112, 期号: 2023, 页码: 106159
作者:
Qianqian Cheng
;
Jialin Chen
;
Xuemin Sun
;
Penglin Zhang
;
Gewen Yi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2023/10/31
TQ-Net: Mixed Contrastive Representation Learning For Heterogeneous Test Questions
会议论文
Virtual, 2023-2-13
作者:
He, Zhu
;
Xihua, Li
;
Xuemin, Zhao
;
Yunbo, Cao
;
Shan, Yu
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2023/06/26
Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wu, Baolei
;
Wang, Yanhong
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/06/20
Copper
Intermetallics
Nanocomposites
Precipitation (chemical)
Ultrasonic applications
Ultrasonic waves
Wetting
Cu substrate
Direct current method
Direct-current
Driving forces
Intermetallics compounds
Liquid solders
Power current
Ultrasonic-vibration
Wetting balance
Wetting behavior
Controllable Fabrication of PdO-PdAu Ternary Hollow Shells: Synergistic Acceleration of H-2-Sensing Speed via Morphology Regulation and Electronic Structure Modulation
期刊论文
SMALL, 2022, 页码: 10
作者:
Li, Qian
;
Yang, Shuang
;
Lu, Xingyu
;
Wang, Tieqiang
;
Zhang, Xuemin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/07/01
electronic states
hydrogen diffusion barriers
palladium
ternary hollow shells
ultrafast H
(2) sensors
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:
Yu Weiyuan
;
Yang Guoqing
;
Sun Xuemin
;
Wang Fengfeng
;
Zhang Tao
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/03/01
ALTSAB
anodic bonding
soldering
float glass
Kovar
An Electrochemical Sensor for H2O2 Based on Au Nanoparticles Embedded in UiO-66 Metal-Organic Framework Films
期刊论文
ACS APPLIED NANO MATERIALS, 2021, 卷号: 4, 期号: 6, 页码: 6103-6110
作者:
Wang, Qianqian
;
Zhang, Xuemin
;
Chai, Xueying
;
Wang, Tieqiang
;
Cao, Tianlong
收藏
  |  
浏览/下载:71/0
  |  
提交时间:2021/10/15
UiO-66 film
Au nanoparticles
in situ growth
electrochemical deposition
hydrogen peroxide sensing
Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wang, Yanhong
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2021/03/02
Copper
Tin
Ultrasonic effects
Ultrasonic testing
Ultrasonic waves
Wetting
Acoustic cavitations
Additional forces
Copper substrates
Cross-section morphology
Interfacial atoms
Ultrasonic sound
Ultrasonic vibration
Wetting balance methods
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Copper Dissolution in Liquid Tin by Direct Current
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 10, 页码: 3425-3432
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
;
Liu, Yun
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Rate constants
Tin
Comsol multiphysics
Copper dissolution
Direct current
Dissolution kinetics
Dissolution rates
Effective charge
Immersion method
Temperature range
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