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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Brazing  Brazing filler metals  Grain size and shape  Intermetallics  Melting point  Microstructure  Nanoparticles  Synthesis (chemical)  Brazing joints  Composite solders  Crystal planes  Driving forces  Interfacial intermetallics  Liquidus temperature  Melting process  Melting properties   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Copper Dissolution in Liquid Tin by Direct Current 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 10, 页码: 3425-3432 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing;  Liu, Yun 收藏  |  浏览/下载：6/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Rate constants  Tin  Comsol multiphysics  Copper dissolution  Direct current  Dissolution kinetics  Dissolution rates  Effective charge  Immersion method  Temperature range   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：6/0  |  提交时间：2020/11/14 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：4/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 4, 页码: 1402-1408 作者:  Liu, Yun;  Yu, Weiyuan;  Wang, Yanhong;  Sun, Xuemin 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Binary alloys  Cavitation  Dissolution  Grain boundaries  Intermetallics  Tin  Ultrasonic equipment  Acoustic cavitations  Bulk diffusions  Formation and evolutions  Intermetallic compound growths  Intermetallic grains  Power dependence  Ultrasonic cavitation  Ultrasonic treatments   Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 4, 页码: 1402-1408 作者:  Liu, Yun;  Yu, Weiyuan;  Wang, Yanhong;  Sun, Xuemin 收藏  |  浏览/下载：6/0  |  提交时间：2020/11/14 Binary alloys  Cavitation  Dissolution  Grain boundaries  Intermetallics  Tin  Ultrasonic equipment  Acoustic cavitations  Bulk diffusions  Formation and evolutions  Intermetallic compound growths  Intermetallic grains  Power dependence  Ultrasonic cavitation  Ultrasonic treatments