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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Digoxin-induced Anemia among Patients with Atrial Fibrillation and Heart Failure: Clinical Data Analysis and Drug-gene Interaction Network (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2,3,4,5,6];  Xue, Yumei[1,2,3,4,5];  He, Siqi[1,2,3,4,5,6];  Feng, Ruiling[1,2,3,4,5,6];  Xu, Zhe[7] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Familial Sudden Cardiac Death Caused by DSG2 Mutation as Genetic Backgrounds: Whole Exome Sequencing and Valid Therapy of Catheter Ablation (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2,3,4,5,6,7];  Zhang, Qianhuan[1,2,3,4,5,6];  Chen, Jia[8];  Feng, Ruiling[1,2,3,4,5,6,7];  He, Siqi[1,2,3,4,5,6,7] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 Whole Exome Sequencing Identified a Pathogenic Mutation in RYR2 in a Chinese Family with Unexplained Sudden Death (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2,3,4,5,6];  Liao, Zili[1,2,3,4,5];  He, Siqi[1,2,3,4,5,6];  Liu, Ruilin[7];  Peng, Yongzheng[8] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 SCN5A Mutants Associated with Familial Cardiac Sodium Overlap Syndrome Characterized as Sick Sinus Syndrome, Atrial Fibrillation, Brugada Syn (CPCI-S收录) 会议 作者:  Lin, Yubi[1,2];  Deng, Chunyu[1,2];  Zhan, XianZhang[1,2];  Xu, Zhe[3];  Zhu, Jiening[1,2] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/11 Reliability analysis and case studies on FCBGA packaged devices (EI收录) 会议 Changsha, China, 作者:  Lin, Xiao-Ling[1];  Xie, Shao-Feng[1];  Yao, Ruo-He[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Chip scale packages  Cracks  Electronics packaging  Failure (mechanical)  Failure analysis  Field programmable gate arrays (FPGA)  Flip chip devices  Integrated circuit interconnects  Packaging  Reconfigurable hardware  Reliability  Soldered joints  Soldering  Soldering alloys  Thermal stress   Reliability Analysis and Case Studies on FCBGA Packaged Devices (CPCI-S收录) 会议 作者:  Lin, Xiao-ling[1];  Xie, Shao-feng[1];  Yao, Ruo-he[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Flip chip plastic ball grid array (FC-PBGA)  thermal stress  reflowing  reliability analysis