| In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage | |
| Guo, Bingfeng; Jiang, Chengrong; Kunwar, Anil; Chen, Jun; Zhao, Ning; Wang, Yunpeng; Ma, Haitao | |
| 2017 | |
| 会议名称 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2017-01-01 |
| 关键词 | Synchrotron radiation heat preservation stage microstructure Cu addition mechanism |
| 页码 | 974-979 |
| 会议录 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3310211 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Dept Mat Sci & Engn, 2 Ling Gong Rd, Dalian, Liaoning, Peoples R China. 2.Dalian Univ Technol, Sch Mech Engn, 2 Ling Gong Rd, Dalian, Liaoning, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Guo, Bingfeng,Jiang, Chengrong,Kunwar, Anil,et al. In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage[C]. 见:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2017-01-01. |
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