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浏览/检索结果: 共19条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Brazing  Brazing filler metals  Grain size and shape  Intermetallics  Melting point  Microstructure  Nanoparticles  Synthesis (chemical)  Brazing joints  Composite solders  Crystal planes  Driving forces  Interfacial intermetallics  Liquidus temperature  Melting process  Melting properties   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint 期刊论文 Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17 作者:  Jin, Yuhua;  Wu, Bo;  Lu, Xuetian;  Xing, Yichu;  Zhou, Zizheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Aluminum  Aluminum alloys  Annealing  Binary alloys  Copper  Copper alloys  Friction  Intermetallics  Microstructure  Research laboratories  Welds  Annealing temperatures  Friction stir welded joints  Growth mechanisms  Interface mi-crostructure  Layered Structures  Original structures  Post-weld annealing  Softening phenomenon   The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文 MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6 作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin 收藏  |  浏览/下载：70/0  |  提交时间：2021/02/02 Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism   The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文 ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8 作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan 收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack   航空发动机防钛火耐腐蚀封严材料的制备与性能研究 学位论文 : 中国科学院大学, 2020 作者:  刘若愚 收藏  |  浏览/下载：15/0  |  提交时间：2021/09/07 金属涂层,聚酰亚胺复合材料,摩擦磨损,盐雾腐蚀   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism