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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan 收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Wetting of liquid aluminum alloys on pure titanium at 873-973 K 期刊论文 Journal of Materials Research and Technology, 2019, 卷号: 8, 期号: 6, 页码: 5813-5822 作者:  Jin, Peng;  Liu, Yibo;  Sun, Qingjie;  Lin, Qiaoli;  Li, Junzhao 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Activation energy  Binary alloys  Drops  Intermetallics  Mass transfer  Oxide films  Silicon compounds  Titanium  Titanium dioxide  Wetting  Decomposition energy  Empirical equations  Gibbs energy of formation  Interfacial mass transfer  Intermetallic layer  Sessile drop method  Spreading dynamics  Viscous dissipation   Formation of Diffusion Layer on Ti-6Al-4V Alloy during Longtime Friction with Al 期刊论文 METALS, 2019, 卷号: 9, 期号: 10, 页码: 8 作者:  Liu, Ruoyu;  Huang, Chuanbing;  Du, Lingzhong;  Lan, Hao;  Fang, Shige 收藏  |  浏览/下载：22/0  |  提交时间：2020/03/24 Ti-6Al-4V  Al  sliding  diffusion   Influence of Brazing Filler Zn on Microstructure and Properties of Titanium/Aluminum Joint by Friction Stir Brazing 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 9, 页码: 3067-3071 and 3100 作者:  Wu, Jingwei;  Zhang, Zhongke;  Che, Pengwei 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Aluminum compounds  Binary alloys  Brazing  Ductile fracture  Fillers  Friction  Friction stir welding  Intermetallics  Microstructure  Scanning electron microscopy  Spectrometers  Temperature distribution  Temperature measurement  Ternary alloys  Titanium compounds  Zinc  Zinc alloys  Brazing fillers  Cross section microstructure  Energy dispersive spectrometers  Friction stir  Highest temperature  Microstructure and properties  Peak temperatures  TC4 and Al6082   Study on welding process and mechanical properties of resistance spot brazed pure aluminum 1060 to galvanized steel 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2019, 卷号: 40, 期号: 9, 页码: 151-155 作者:  Zhang, Changqing;  Jin, Xin;  Wang, Weijie;  Qin, Zhuo;  Rong, Chen 收藏  |  浏览/下载：13/0  |  提交时间：2020/11/14 Aluminum alloys  Brazing  Brazing filler metals  Galvanizing  Heat affected zone  Heat resistance  Intermetallics  Mechanical properties  Microstructure  Shear flow  Spot welding  Double layer structure  Galvanized steels  Hot dip galvanized steels  Interfacial layer  Process parameters  Pure aluminum  Resistance spot welding  Tensile shear load   Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 428-437 作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15 Shear strength  Electroplated Cu  Aging  Kovar alloy  Microstructure   Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 SAC305 lead-free solders  Interfacial reaction  Intermetallic compound  Shear strength  Fracture   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling