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CORC

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Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 5, 页码: 3876-3889
作者:  Xu, Tao;  Hu, Xiaowu;  Li, Jiayin;  Li, Qinglin
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint 期刊论文
Journal of Applied Physics, 2015, 卷号: 117, 期号: 1
L. M.; Zhang Yang, Z. F.
收藏  |  浏览/下载：17/0  |  提交时间：2015/05/08
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
L. M.; Zhang Yang, Z. F.
收藏  |  浏览/下载：24/0  |  提交时间：2015/05/08
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2015, 卷号: 31, 页码: 252-256
作者:  Huang, M. L.;  Yang, F.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-01-01
作者:  Chen, Leida;  Feng, Yi;  Liu, Xiaoyan;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joints 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, 2013-08-11
作者:  Chen L.;  Feng Y.;  Liu X.;  Huang M.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
添加Sb和LaB6对Sn3．0Ag0．5Cu／Cu界面IMC生长的影响 期刊论文
《半导体技术》, 2012, 卷号: 37, 页码: 42-46
作者:  龙琳[1];  陈强[1];  廖小雨[1];  李国元[1]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26
Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 卷号: 23, 页码: 2-7
作者:  Zou, Changdong[1];  Gao, Yulai[2];  Yang, Bin[3];  Zhai, Qijie[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30

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