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	Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints
	Chen, Leida; Feng, Yi; Liu, Xiaoyan; Huang, Mingliang
	2013
会议名称	14th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2013-01-01
会议地点	Chinese Inst Elect, Dalian, PEOPLES R CHINA
关键词	Electromigration (Au, Pd, Ni)Sn-4 Ni-P interfacial reaction
页码	1064-+
会议录	14th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4542904
专题	大连理工大学
作者单位	1.Xian Inst Microelect Technol, IC Packaging Dept, Xian 710600, Peoples R China. 2.Dalian Univ Technol, Elect Packaging Mat Lab, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	Chen, Leida,Feng, Yi,Liu, Xiaoyan,et al. Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints[C]. 见:14th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Dalian, PEOPLES R CHINA. 2013-01-01.

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