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	Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints
	Huang, M. L.; Yang, F.
刊名	JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
	2015
卷号	31页码:252-256
关键词	Size effect Lead-free solder Interfacial reaction Intermetallic compound Sn-3.0Ag-0.5Cu Electroless nickel electroless palladium immersion gold (ENEPIG) pad
ISSN号	1005-0302
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4406016
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Huang, M. L.,Yang, F.. Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2015,31:252-256.
APA	Huang, M. L.,&Yang, F..(2015).Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,31,252-256.
MLA	Huang, M. L.,et al."Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 31(2015):252-256.

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