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CORC

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Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro Bumps 会议论文
作者:  Cao LQ(曹立强);  Dai FW(戴风伟);  David Wei Zhang;  Weiqi Zhang;  Guojun Wang
收藏  |  浏览/下载：19/0  |  提交时间：2019/05/15
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Morphological study of borosilicate glass surface irradiated by heavy ions 会议论文
19th International Conference on Surface Modification of Materials by Ion Beams (SMMIB), Chiang Mai, THAILAND, NOV 22-27, 2015
作者:  Wang, TS;  Du, X;  Yuan, W;  Duan, BH;  Zhang, JD
收藏  |  浏览/下载：7/0  |  提交时间：2017/05/11
Effect of Mineralized Layer Topographies on Stem Cell Behavior in Microsphere Scaffold 期刊论文
Journal of Materials Science & Technology, 2016
作者:  Jie Hou;  Huichang Gao;  Yingjun Wang;  Delin Cheng;  Xiaodong Cao
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/16
Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs 其他
2016-01-01
Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Morphological study of borosilicate glass surface irradiated by heavy ions 期刊论文
Surface and Coatings Technology, 2016, 卷号: 306, 页码: 245-250
作者:  Wang, T. S.;  Du, X.*;  Yuan, W.;  Duan, B. H.;  Zhang, J. D.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill 其他
2015-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03

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