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	Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs
	Zeng, Qinghua ; Chen, Jing ; Jin, Yufeng
	2016
英文摘要	Complicated processes of through-silicon-via fabrication makes low yield of through-silicon-via mass production. Through-silicon-via redundancy is one of various ways that have been put forward to improve reliability of electrical interconnections. Allocation of through-silicon-vias is changed as redundant through-silicon-vias are added. Consequently, thermal dissipation and thermal mechanical reliability need evaluating anew. This paper focuses on how thermal mechanical reliability of a three dimensional package changes before and after redundant through-silicon-vias are added. It turns out that stress condition of silicon chip, micro-bumps and through-silicon-vias becomes worse in the case of through-silicon-via redundancy.; National Natural Science Foundation of China [U1537208]; National Program on Key Basic Research Project (973 Program) [2015CB057201]; CPCI-S(ISTP); 213-216
语种	英语
出处	18th IEEE Electronics Packaging Technology Conference (EPTC)
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/470091]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zeng, Qinghua,Chen, Jing,Jin, Yufeng. Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs. 2016-01-01.

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