CORC

在结果中检索

CORC

浏览/检索结果: 共36条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文
Vacuum, 2020, 卷号: 180
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：21/0  |  提交时间：2020/11/14
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2022/03/01
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7
作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin;  Li, Shuang
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15
Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7
作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15
Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562
作者:  Wang, Haozhong;  Hu, Xiaowu;  Li, Qinglin;  Qu, Min
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: Vol.30 No.10, 页码: 9634-9641
作者:  Yan, H.a,b;  Mei, Y.-H.a,b;  Wang, M.a,b;  Li, X.a,b;  Lu, G.-Q.b,c
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/21
User-defined microstructures array fabricated by DMD based multistep lithography with dose modulation 期刊论文
Optics Express, 2019, 卷号: 27, 期号: 22, 页码: 31956-31966
作者:  Y.Zhang;  J.Luo;  Z.Xiong;  H.Liu;  L.Wang
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24

©版权所有 ©2017 CSpace - Powered by CSpace