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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14
Development of a Short REBCO Undulator Magnet With Resistive Joints 期刊论文
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2019, 卷号: 29, 期号: 5, 页码: —
作者:  Liu, SC;  Ding, Y;  Xu, JP
收藏  |  浏览/下载：23/0  |  提交时间：2019/12/30
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文
Materials and Design, 2018, 卷号: 150, 页码: 9-16
作者:  Yu, Weiyuan;  Liu, Yun;  Liu, Xinya
收藏  |  浏览/下载：4/0  |  提交时间：2022/02/17
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 150, 页码: 9-16
作者:  Yu, Weiyuan;  Liu, Yun;  Liu, Xinya
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/15
Low-Resistance and Strong-Adhesion Soldering of Second-Generation High-Temperature Superconductor Tapes Within a Short Time 期刊论文
IEEE Transactions on Applied Superconductivity, 2017, 卷号: 27
作者:  Zheng, Jiahui[1];  Ma, Hongliang[2];  He, Rong[3];  Lu, Yuming[4];  Song, Haoyu[5]
收藏  |  浏览/下载：10/0  |  提交时间：2019/04/24
Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler (EI收录) 期刊论文
Materials Science and Engineering A, 2017, 卷号: 680, 页码: 317-323
作者:  Cheng, L.X.[1];  Liu, M.R.[2];  Wang, X.Q.[3];  Yan, B.H.[1];  Li, G.Y.[4]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24
Study on low temperature brazing of magnesium alloy to aluminum alloy using Sn-xZn solders 期刊论文
MATERIALS & DESIGN, 2012, 卷号: 39, 页码: 14-19
作者:  Wang, Zhi;  Wang, Hongyang;  Liu, Liming
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
Recent development of electronic packaging technology 期刊论文
2010, 2010
Fu Yuepeng; Tan Kai; Tian Minbo
收藏  |  浏览/下载：4/0
电子封装技术的最新进展 期刊论文
2010, 2010
傅岳鹏; 谭凯; 田民波; Fu Yuepeng; Tan Kai; Tian Minbo
收藏  |  浏览/下载：5/0

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