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CORC

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Microstructure and tribological behaviors of diffusion bonded powder sintered Cu–Sn based alloys 期刊论文
Materials Research Express, 2021, 期号: 8, 页码: 116505
作者:  Li Zhenyu;  Zhao Gengrui;  Wang Honggang;  Gao Gui;  Chen Shengsheng
收藏  |  浏览/下载：24/0  |  提交时间：2021/11/22
Microstructure and tribological behaviors of diffusion bonded powder sintered Cu-Sn based alloys 期刊论文
MATERIALS RESEARCH EXPRESS, 2021, 卷号: 8, 期号: 11
作者:  Li, Zhenyu;  Zhao, Gengrui;  Wang, Honggang;  Gao, Gui;  Chen, Shengsheng
收藏  |  浏览/下载：20/0  |  提交时间：2021/12/17
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02

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