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兰州理工大学 [7]
上海大学 [7]
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期刊论文 [34]
会议论文 [2]
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Modeling motion and growth of multiple dendrites during solidification based on vector-valued phase field and two-phase flow models
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 58, 页码: 171-187
作者:
Ren, Jian-kun
;
Chen, Yun
;
Cao, Yan-fei
;
Sun, Ming-yue
;
Xu, Bin
收藏
  |  
浏览/下载:81/0
  |  
提交时间:2021/02/02
Phase field
Solidification
Two-phase flow
Dendrite's motion
Variable viscosity
Effect of symmetrical tilt grain boundary on the compatibility between copper and liquid lithium: Atomistic simulations
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 835
作者:
Xu, Chao
;
Wei, Jun
;
Huang, Bowen
;
Meng, Xiancai
;
Xiao, Shifang
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  |  
浏览/下载:48/0
  |  
提交时间:2020/10/26
Grain boundary
Cu-Li solid-Liquid interface
Compatibility
Penetration
Simulation
Intermediate Structures of Nucleation and Growth during Solidification of CuO Constrained by Graphene
期刊论文
ADVANCED MATERIALS INTERFACES, 2020, 页码: 5
作者:
Ge MK
;
Yuan WJ
;
Zhou LL(周玲玲)
;
Deng ZL
;
Hu M
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  |  
浏览/下载:68/0
  |  
提交时间:2020/04/07
CuO
intermediate structures
nucleation
solidification
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:
Sui, Ran
;
Li, Fuxiang
;
Ci, Wenjuan
;
Lin, Qiaoli
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Bismuth alloys
Copper
Copper oxides
Joining
Oxide films
Phase interfaces
Soldering
Ternary alloys
Tin compounds
Wetting
Cu intermetallics
IMC layer
Interfacial reactivity
Interfacial structures
Sessile drop method
Sn-Bi alloy
Spreading characteristics
Ternary phase diagrams
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:
Sui, Ran
;
Li, Fuxiang
;
Ci, Wenjuan
;
Lin, Qiaoli
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  |  
浏览/下载:7/0
  |  
提交时间:2019/11/15
Wettability
soldering
joining
Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering
期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771
作者:
Yu, Wei-Yuan
;
Liu, Ying-Zong
;
Wu, Wei-Jie
;
Li, Fu-Xiang
;
Xing, Chun-Xiao
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  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Binary alloys
Brazing
Copper compounds
Diffusion
Dissolution
Intermetallics
Lead-free solders
Phase interfaces
Tin alloys
Tin compounds
Cu-Sn intermetallics
Dissolution model
Evolution of the microstructure
Formation and evolutions
Formation mechanism
Planar shape
Soldering process
Solid-liquid interfaces
The Interfacial Characterization and Performance of Cu/Al-Conductive Heads Processed by Explosion Welding, Cold Pressure Welding, and Solid-Liquid Casting
期刊论文
2019, 卷号: 9
作者:
Wei, Yanni
;
Li, Hui
;
Sun, Fu
;
Zou, Juntao
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  |  
浏览/下载:56/0
  |  
提交时间:2019/12/20
Cu/Al conductive head
explosion welding
cold pressure welding
solid-liquid casting
interface structures
conductivity
A LiPO2F2/LiFSI dual-salt electrolyte enabled stable cycling of lithium metal batteries
期刊论文
JOURNAL OF POWER SOURCES, 2018, 卷号: 400, 页码: 449-456
作者:
Dong, Ning
;
Yang, Guanghua
;
Luo, Hao
;
Xu, Hewei
;
Xia, Yonggao
收藏
  |  
浏览/下载:44/0
  |  
提交时间:2018/12/04
Rechargeable Batteries
Solid Electrolytes
Dendrite Growth
Liquid
Anodes
Performance
Mechanisms
Deposition
Interface
Stability
A LiPO2F2/LiFSI dual-salt electrolyte enabled stable cycling of lithium metal batteries
期刊论文
JOURNAL OF POWER SOURCES, 2018, 卷号: 400, 页码: 449-456
作者:
Dong, Ning
;
Yang, Guanghua
;
Luo, Hao
;
Xu, Hewei
;
Xia, Yonggao
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2018/12/04
Rechargeable Batteries
Solid Electrolytes
Dendrite Growth
Liquid
Anodes
Performance
Mechanisms
Deposition
Interface
Stability
Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting
期刊论文
2018, 卷号: 252, 页码: 795-803
作者:
Li, Hanyan
;
Chen, Wenge
;
Dong, Longlong
;
Shi, Yingge
;
Liu, Jie
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/20
Cu-Al composites
Annealing treatment
Interface
Inter-diffusion
Interaction
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