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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fracture performance test of wave transparent brittle materials of hypersonic vehicle under high-heat-flow thermal shock [高超声速飞行器脆性透波材料大热流冲击下断裂性能试验] 期刊论文 Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2019, 卷号: 40 作者:  Wu, D.;  Lin, L.;  Ren, H.;  Zhu, F. 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/30 Alumina  Aluminum oxide  Antennas  Brittleness  Correlation methods  Electronics packaging  Fracture  Heat flux  Hypersonic aerodynamics  Image analysis  Infrared radiation  Locks (fasteners)  Silica  Speckle  Strain measurement  Thermal shock  Vehicle performance  Digital image correlation methods  Fracture performance  Fracture time  Location detection  Maximum heat flux  Reliability design  Shock simulation  Wave-transparent  Hypersonic vehicles   Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip 期刊论文 REVIEW OF SCIENTIFIC INSTRUMENTS, 2019, 卷号: 90, 页码: 063108 作者:  Su, Fei;  Li, Tenghui 收藏  |  浏览/下载：30/0  |  提交时间：2019/12/30 Birefringence  Electronics packaging  Light polarization  Optical devices  Silicon  Thermal cycling  Three dimensional integrated circuits  Distribution area  High gradient stress  Phase difference  Phase-shifting technique  Polarized microscope  Quarter wave-plate  Stress birefringence  Through silicon vias  Vibrations (mechanical)   Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications 期刊论文 MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20 作者:  An, Zhonglie;  Li, Jinhua;  Kikuchi, Akio;  Wang, Zhuqing;  Jiang, Yonggang 收藏  |  浏览/下载：101/0  |  提交时间：2019/12/30 Copper compounds  Electronics packaging  Graphene  Integration  Mechanical properties  MEMS  Natural frequencies  Thermal expansion  Three dimensional integrated circuits  Coefficients of thermal expansions  Composite microstructures  Interconnect applications  Laser Doppler vibrometers  Mechanical resonant frequencies  Micro electro mechanical system  Thermal expansion mismatch  Through-Silicon-Via (TSV)  Integrated circuit interconnects   Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Li, T.;  Yao, R.;  Yu, C.;  Su, F. 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 Cracks  Elasticity  Electronics packaging  Light polarization  Microscopes  Optical devices  Silicon carbide  Silicon wafers  Stresses  Wafer bonding  Wide band gap semiconductors  Electronic Packaging  Heating platform  Phase difference  Quarter wave-plate  Si-based materials  Silicon-based materials  Stress birefringence  Temperature cycling tests  Three dimensional integrated circuits   The Optimum pre calibration curve of power amplifier in OFDM system 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Chen, Y.;  Cai, C.;  Chen, Q. 收藏  |  浏览/下载：22/0  |  提交时间：2019/12/30 Calibration  Electronics packaging  Inverse problems  Nonlinear distortion  Orthogonal frequency division multiplexing  Orthogonal functions  Amplitude distributions  Correction curves  Inverse functions  Multicarrier signal  Optimal synthesis  Peak to average ratios  Performance improvements  Pre calibrations  Power amplifiers   Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y. 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Finite element method  Reliability  Thermal cycling  Viscoelasticity  Chip deformations  Relaxation modulus  Silicon interposers  Temperature dependent  Thermal-mechanical reliability  Time dependent  Viscoelastic properties  Williams-Landel-Ferry equations  Three dimensional integrated circuits   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Failure (mechanical)  Fatigue of materials  Finite element method  Shear stress  Soldering  Stresses  Thermal load  Timing circuits  Global simulation  Interfacial failures  Load condition  Maximum principal stress  Resistance measurement  Solder balls  Thermal mechanical stress  Thermal-mechanical reliability  Three dimensional integrated circuits