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CORC

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Category-Level 6D Object Pose Estimation With Structure Encoder and Reasoning Attention 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY, 2022, 卷号: 32, 期号: 10, 页码: 6728-6740
作者:  Liu, Jierui;  Cao, Zhiqiang;  Tang, Yingbo;  Liu, Xilong;  Tan, Min
收藏  |  浏览/下载：17/0  |  提交时间：2022/11/14
Laminated three-dimensional carbon nanotube integrated circuits 期刊论文
NANOSCALE, 2022, 页码: 6
作者:  Jian, Yang;  Sun, Yun;  Feng, Shun;  Zang, Chao;  Li, Bo
收藏  |  浏览/下载：22/0  |  提交时间：2022/07/01
An Edge 3D CNN Accelerator for Low-Power Activity Recognition 期刊论文
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2021, 卷号: 40, 期号: 5, 页码: 918-930
作者:  Wang, Ying;  Wang, Yongchen;  Shi, Cong;  Cheng, Long;  Li, Huawei
收藏  |  浏览/下载：21/0  |  提交时间：2021/12/01
Neutron-induced single event upset simulation in Geant4 for three-dimensional die-stacked SRAM* 期刊论文
CHINESE PHYSICS B, 2021, 卷号: 30, 期号: 3, 页码: 8
作者:  Mo, Li-Hua;  Ye, Bing;  Liu, Jie;  Luo, Jie;  Sun, You-Mei
收藏  |  浏览/下载：33/0  |  提交时间：2021/12/10
Evaluation Method of Heavy-Ion-Induced Single-Event Upset in 3D-Stacked SRAMs 期刊论文
ELECTRONICS, 2020, 卷号: 9, 期号: 8, 页码: 14
作者:  Zhao, Peixiong;  Liu, Tianqi;  Cai, Chang;  He, Ze;  Li, Dongqing
收藏  |  浏览/下载：14/0  |  提交时间：2021/12/15
Fabrication and measurement of 3D LPF based on coaxial TSV 期刊论文
2019, 卷号: 55, 页码: 102-+
作者:  Wang, Fengjuan;  Li, He;  Yu, Ningmei
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/20
LC Low-pass filter based on through-silicon via 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Li, Yue;  Yu, Ningmei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20
An Effective Method of Reducing TSV Thermal Stress by STI 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Qu, Xiaoqing;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip 期刊论文
REVIEW OF SCIENTIFIC INSTRUMENTS, 2019, 卷号: 90, 页码: 063108
作者:  Su, Fei;  Li, Tenghui
收藏  |  浏览/下载：30/0  |  提交时间：2019/12/30

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