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Comprehensive characterization of TSV etching performance with phase-contrast X-ray microtomography
期刊论文
JOURNAL OF SYNCHROTRON RADIATION, 2020, 卷号: 27, 页码: 1023-1032
作者:
Li, K
;
Deng, B
;
Zhang, HP
;
Yu, FC
;
Xue, YL
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2021/09/06
SILICON VIAS
RETRIEVAL
PROFILE
Study on copper protrusion of through-silicon via in a 3-D integrated circuit
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:
Song M
;
Wei ZQ
;
Wang BY
;
Chen L
;
Chen L
收藏
  |  
浏览/下载:53/0
  |  
提交时间:2019/11/27
Through-silicon via
Cu protrusion
Annealing temperature
Electron backscatter diffraction
Finite element analysis
Investigation on impact of substrate on low-pass filter based on coaxial TSV
期刊论文
2019, 卷号: 16
作者:
Wang, Fengjuan
;
Li, He
;
Yu, Ningmei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/20
through-silicon-via (TSV)
low-pass filter (LPF)
substrate impact
Fabrication and measurement of 3D LPF based on coaxial TSV
期刊论文
2019, 卷号: 55, 页码: 102-+
作者:
Wang, Fengjuan
;
Li, He
;
Yu, Ningmei
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/20
finite element analysis
three-dimensional integrated circuits
low-pass filters
passive filters
CMOS integrated circuits
standard CMOS process
3D LPF architecture
coaxial TSV
passive low-pass filters
3D LPF measurement
3D LPF fabrication
through-silicon via
finite element method
LC Low-pass filter based on through-silicon via
会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/20
low-pass filter
through-silicon via (TSV)
three-dimensional integrated circuits (3-D IC)
An Effective Method of Reducing TSV Thermal Stress by STI
会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:
Wang, Fengjuan
;
Qu, Xiaoqing
;
Yu, Ningmei
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/20
Keywords Three-dimensional integrated circuits (3-D IC)
through-silicon via (TSV)
shallow trench isolation (STI)
thermal stress
keep-out zone (KOZ)
A high-pass filter based on through-silicon via (TSV)
期刊论文
2019, 卷号: 16, 页码: 1-3
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/20
through-silicon via (TSV)
high-pass filter
three-dimensional integrated circuit (3D IC)
Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications
期刊论文
MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20
作者:
An, Zhonglie
;
Li, Jinhua
;
Kikuchi, Akio
;
Wang, Zhuqing
;
Jiang, Yonggang
收藏
  |  
浏览/下载:101/0
  |  
提交时间:2019/12/30
Copper compounds
Electronics packaging
Graphene
Integration
Mechanical properties
MEMS
Natural frequencies
Thermal expansion
Three dimensional integrated circuits
Coefficients of thermal expansions
Composite microstructures
Interconnect applications
Laser Doppler vibrometers
Mechanical resonant frequencies
Micro electro mechanical system
Thermal expansion mismatch
Through-Silicon-Via (TSV)
Integrated circuit interconnects
An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
作者:
Zhou, Hao
;
Zhu, Hengliang
;
Cui, Tao
;
Pan, David Z.
;
Zhou, Dian
收藏
  |  
浏览/下载:44/0
  |  
提交时间:2018/11/16
Domain decomposition (DD)
drop test
reliability
through-silicon via (TSV)
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