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CORC

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Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle 期刊论文
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2019, 卷号: 16, 页码: 668-677
作者:  Liu, Dong;  Teo, Chek Sing;  Liang, Wenyu;  Tan, Kok Kiong
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm 期刊论文
SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, 2019, 卷号: 7
作者:  Pan, Tingting;  Yang, Jie;  Wu, Wei;  Dung, Zhigang;  Ayinde, Babajide O.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scanning interferometry (WLSI 会议论文
SPIE2019
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收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Photochemically combined mechanical polishing of N-type gallium nitride wafer in high efficiency 期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2019, 卷号: 55, 页码: 14-21
作者:  Ou, Li -Wei;  Wang, Ya-Hui;  Hu, Hui-Qing;  Zhang, Liang-Liang;  Dong, Zhi-Gang
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes 期刊论文
International Journal of Advanced Manufacturing Technology, 2019
作者:  Ou, L.;  Dong, Z.;  Kang, R.;  Shi, K.;  Guo, D.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Sulfur encapsulated in a wafer-like carbon substrate with interconnected meso/micropores for high-performance lithium-sulfur batteries 期刊论文
Inorganic Chemistry Frontiers, 2019, 卷号: 6, 页码: 3264-3269
作者:  Zhang, Ya-Bo;  Zhao, Yang;  Hao, Xiao-Feng;  Ma, Yuan-Chuan;  Wu, Yang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer 期刊论文
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2018, 卷号: 140
作者:  Lin, Bin;  Zhou, Ping;  Wang, Ziguang;  Yan, Ying;  Kang, Renke
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02

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