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兰州理工大学 [21]

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限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Electronic and magnetic properties of sub-unit cell α-Fe2O3 films on the α-Al2O3 (0001) substrate 期刊论文 Computational Materials Science, 2022, 卷号: 210 作者: Niu, Jiajia; Jiang, Yixiao; He, Yibo; Tao, Ang; Chen, Chunlin 收藏 \| 浏览/下载：26/0 \| 提交时间：2022/06/20 Alumina Aluminum oxide Antiferromagnetism Cells Cytology Energy gap Ferromagnetic materials Ferromagnetism Hematite Interface states Magnetic properties Metals Oxide films Substrates Electron state at interface Electronic and magnetic properties Fe O First principle calculations Magnetic configuration Magnetic properties of interfaces Metallic oxides Sub-units Type II Unit cells
	Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文 Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322 作者: Hu, Guanqun; Huang, Rui; Wang, Hongli; Zhao, Qiuping; Zhang, Xingkai 收藏 \| 浏览/下载：38/0 \| 提交时间：2022/06/20 Chlorine compounds Corrosion resistance Electroless plating Eutectics Metallic films Morphology Nickel Nickel coatings Nickel compounds Nickel plating Palladium Phosphorus Solvents Surface morphology Surface treatment Activation ability Copper substrates Deep eutectic solvents Electroless Ni-P Electroless nickel-phosphorus plating Galvanic replacement deposition Galvanic replacements Nickel film Nickel phosphorus Palladium films
	Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文 Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629 作者: Sui, Ran; Tan, Kaihui; Lin, Qiaoli; Xie, Kaibin 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/08/09 Activation analysis Activation energy Binary alloys Bond strength (chemical) Brazing Diffusion bonding Phase interfaces Tin alloys Yttria stabilized zirconia Yttrium oxide Zircaloy Dissolutive wetting Interface formation Liquid/solid interface Metallicities Modified sessile drop method Non-metallic Soldering Titania Yttria-stabilized Zirconia substrates
	Performance and local structure evolution of NbMoTaWV entropy-stabilized oxide thin films with variable oxygen content 期刊论文 Surface and Coatings Technology, 2020, 卷号: 402 作者: Bi, Linxia; Li, Xiaona; Li, Zhumin; Hu, Yinglin; Zhang, Junyi 收藏 \| 浏览/下载：20/0 \| 提交时间：2020/11/14 Crystal atomic structure Entropy Film preparation Hardness Magnetic semiconductors Magnetron sputtering Molybdenum alloys Niobium alloys Oxide minerals Oxide semiconductors Oxygen Refractory metals Silicon wafers Single crystals Tantalum alloys Thin films Titanium dioxide Tungsten alloys Vanadium alloys Amorphous oxide semiconductor (AOS) Application prospect Conductive mechanisms Metal oxide thin films Radio frequency magnetron sputtering Room-temperature resistivity Temperature behavior Wide temperature ranges
	Performance and local structure evolution of NbMoTaWV entropy-stabilized oxide thin films with variable oxygen content 期刊论文 Surface and Coatings Technology, 2020, 卷号: 402 作者: Bi, Linxia; Li, Xiaona; Li, Zhumin; Hu, Yinglin; Zhang, Junyi 收藏 \| 浏览/下载：19/0 \| 提交时间：2022/02/17 Crystal atomic structure Entropy Film preparation Hardness Magnetic semiconductors Magnetron sputtering Molybdenum alloys Niobium alloys Oxide minerals Oxide semiconductors Oxygen Refractory metals Silicon wafers Single crystals Tantalum alloys Thin films Titanium dioxide Tungsten alloys Vanadium alloys Amorphous oxide semiconductor (AOS) Application prospect Conductive mechanisms Metal oxide thin films Radio frequency magnetron sputtering Room-temperature resistivity Temperature behavior Wide temperature ranges
	Cladding Inconel 625 on cast iron via bypass coupling micro-plasma arc welding 期刊论文 Journal of Manufacturing Processes, 2020, 卷号: 56, 页码: 106-115 作者: Huang, Jiankang; Liu, Shien; Yu, Shurong; An, Liang; Yu, Xiaoquan 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Cladding (coating) Corrosion resistance Corrosion resistant alloys Electric welding Nickel alloys Plasma welding Substrates Vickers hardness Bonding interfaces Bypass coupling Bypass current Cladding layer Fusion zones Harsh environment Metallic substrate Micro-plasma arc welding
	Wetting behavior of Cu6Sn5 IMC by molten Sn 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 3, 页码: 33-37 作者: Li, Fuxiang; Wang, Jianbin; Ye, Changsheng; Lin, Qiaoli 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Activation energy Binary alloys Gold Oxide films Substrates Tin compounds Ion sputtering Linear variation Metallic substrate Modified sessile drop method Reaction limiteds Spreading dynamics Wetting behavior Wetting process
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Surface-enhanced Raman scattering by composite structure of gold nanocube-PMMA-gold film 期刊论文 OPTICAL MATERIALS EXPRESS, 2019, 卷号: 9, 期号: 4, 页码: 1872-1881 作者: Wang, Xiangxian; Bai, Xuelin; Pang, Zhiyuan; Zhu, Jiankai; Wu, Yuan 收藏 \| 浏览/下载：13/0 \| 提交时间：2019/11/15 Esters Gold Laser excitation Metallic films Nanocomposite films Raman scattering Raman spectroscopy Shims Structure (composition) Substrates Surface plasmons Excitation sources Finite element method simulation Poly(methyl methacrylate) (PMMA) Raman enhancement Rhodamine 6G SERS spectrum Spacer layer thickness Surface enhanced Raman Scattering (SERS)
	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K 期刊论文 Journal of Alloys and Compounds, 2018, 卷号: 767, 页码: 877-882 作者: Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Copper oxides Gold Intermetallics Joining Lead-free solders Oxide films Oxide minerals Soldering Substrates Tin Cu intermetallics Driving forces Key factors Lead-Free Metallic substrate Precipitation reaction Sessile drop method Thin oxide films

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