Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

doi:10.1007/s10008-022-05172-4

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	Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating
	Hu, Guanqun 1,4; Huang, Rui 2; Wang, Hongli 3; Zhao, Qiuping 1; Zhang, Xingkai 4
刊名	Journal of Solid State Electrochemistry
	2022-05-01
卷号	26 期号:5 页码:1313-1322
关键词	Chlorine compounds Corrosion resistance Electroless plating Eutectics Metallic films Morphology Nickel Nickel coatings Nickel compounds Nickel plating Palladium Phosphorus Solvents Surface morphology Surface treatment Activation ability Copper substrates Deep eutectic solvents Electroless Ni-P Electroless nickel-phosphorus plating Galvanic replacement deposition Galvanic replacements Nickel film Nickel phosphorus Palladium films
ISSN号	1432-8488
DOI	10.1007/s10008-022-05172-4
英文摘要	Electroless nickel-phosphorus plating is an important surface treatment method for copper due to its good corrosion resistance and nonmagnetic properties. However, a palladium activation procedure is needed owing to the inactiveness of copper to hypophosphite. Herein, nickel film, which could act as an activator, was deposited on copper through abnormal galvanic replacement deposition in the deep eutectic solvent containing nickel chloride in 10 min, which was 1/30 of the deposition time in other report (5 h). The open circuit potential tests proved that the practical potential of pure copper was obviously reduced to be lower than that of nickel in deep eutectic solvent, which made the deposition of nickel on copper through galvanic replacement reaction probable. It was remarkable that electroless nickel-phosphorus plating could be directly initiated by the as-prepared nickel film. The surface morphology, cross-sectional morphology, composition, and corrosion resistance of nickel-phosphorus coatings prepared on nickel and palladium films were characterized and compared. The results showed that the nickel-phosphorus coatings initiated by nickel and palladium films had similar morphology, composition, structure, and corrosion resistance. This result indicated that the nickel film prepared by galvanic replacement deposition possessed good activation ability to electroless nickel-phosphorus plating on copper, which was comparable to palladium film. © 2022, The Author(s), under exclusive licence to Springer-Verlag GmbH Germany, part of Springer Nature.
语种	英语
出版者	Springer Science and Business Media Deutschland GmbH
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/158495]
专题	石油化工学院
作者单位	1.College of Petrochemical Technology, Lanzhou University of Technology, Lanzhou; 730050, China; 2.College of Physics and Electronic Engineering, Northwest Normal University, Lanzhou; 730070, China; 3.State Key Laboratory for Oxo Synthesis and Selective Oxidation, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou; 730000, China 4.Key Laboratory of Science and Technology On Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou; 730000, China;
推荐引用方式 GB/T 7714	Hu, Guanqun,Huang, Rui,Wang, Hongli,et al. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating[J]. Journal of Solid State Electrochemistry,2022,26(5):1313-1322.
APA	Hu, Guanqun,Huang, Rui,Wang, Hongli,Zhao, Qiuping,&Zhang, Xingkai.(2022).Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating.Journal of Solid State Electrochemistry,26(5),1313-1322.
MLA	Hu, Guanqun,et al."Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating".Journal of Solid State Electrochemistry 26.5(2022):1313-1322.