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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Fengfeng;  Wu, Baolei;  Wang, Yanhong 收藏  |  浏览/下载：21/0  |  提交时间：2022/06/20 Copper  Intermetallics  Nanocomposites  Precipitation (chemical)  Ultrasonic applications  Ultrasonic waves  Wetting  Cu substrate  Direct current method  Direct-current  Driving forces  Intermetallics compounds  Liquid solders  Power current  Ultrasonic-vibration  Wetting balance  Wetting behavior   Strong elemental interaction enhances the thermal stability of coherent precipitation strengthened Cu-Ni-Al alloys 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 827 作者:  Li, Z. M.;  Li, X. N.;  Yuan, J. H.;  Hu, Y. L.;  Zheng, Y. H. 收藏  |  浏览/下载：4/0  |  提交时间：2021/10/14 Copper alloy  Coherent precipitation  Discontinuous precipitation  Thermal stability  Work function   Strong elemental interaction enhances the thermal stability of coherent precipitation strengthened Cu–Ni–Al alloys 期刊论文 Materials Science and Engineering A, 2021, 卷号: 827 作者:  Li, Z.M.;  Li, X.N.;  Yuan, J.H. 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Aluminum alloys  Binary alloys  Calculations  Copper alloys  Dissolution  Free energy  Gibbs free energy  Grain boundaries  Nickel compounds  Silicon alloys  Thermodynamic stability  Work function  Coherent precipitation  Cu content  Discontinuous precipitation  Grain-boundaries  High-temperature properties  Lattice misfits  matrix  NiAl alloy  Re-dissolution  Si addition   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Copper Dissolution in Liquid Tin by Direct Current 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 10, 页码: 3425-3432 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing;  Liu, Yun 收藏  |  浏览/下载：6/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Rate constants  Tin  Comsol multiphysics  Copper dissolution  Direct current  Dissolution kinetics  Dissolution rates  Effective charge  Immersion method  Temperature range   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：6/0  |  提交时间：2020/11/14 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 4, 页码: 90-96 作者:  Sui, Ran;  Lin, Qiaoli 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Contact angle  Copper alloys  Microstructure  Monocrystalline silicon  Oxide films  Silicon alloys  Silver alloys  Tin alloys  Titanium alloys  Titanium oxides  Active components  Dissolution-reprecipitation  Monocrystalline  Solid/liquid interfaces  Temperature dependent  Temperature-induced  Wetting behavior  Wetting mechanism   Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Activation energy  Copper  Electronics packaging  Liquids  Tin  Ultrasonic waves  Dissolution behavior  Dissolution rates  Electronic Packaging  IMC layer  Immersion method  Immersion time  Ultrasonic power  Welding method